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Conductive silver glue for chip packaging

О себе

Дата рождения: NaN.NaN.NaN
Образование:  Незаконченное высшее
Место проживания:  Орловская область
Сайт автора: https://www.deepmaterialcn.com/conductive-silver-glue-for-chip-packaging-and-bonding.html
О себе:
Conductive silver glue products cured with high conductivity, thermal conductivity, high temperature resistance and other high reliability performance. The product is suitable for high-speed dispensing, dispensing good conformability, glue point does not deform, not collapse, not spread; cured material moisture, heat, high and low temperature resistance. 80 ℃ low temperature fast curing, good electrical conductivity and thermal conductivity.